Clean oven is an important equipment in the semiconductor industry, in the semiconductor manufacturing process, drying is a very critical step to ensure that the surface of the chip moisture and organic matter are completely removed, thereby improving the quality and performance of the chip. The clean and dust-free oven is a device specially designed for semiconductor chip drying.First, the subsequent processing of semiconductor chipsIn the manufacturing process of semiconductor chips, the silicon wafer is first cut, and then treated with corrosion, cleaning, electroplating and drying to form chip products. Drying is an indispensable step in the semiconductor manufacturing process, which can remove moisture and organic matter from the surface of the chip to ensure the quality and performance of the chip.Second, the role of clean and dust-free ovenThe clean and dust-free oven is a equipment specially designed for semiconductor chip drying, which can remove the water and organic matter on the surface of the chip in a short time to ensure the dry state of the chip. The role of clean and dust-free oven in the semiconductor industry is as follows:1, ensure the quality and performance of the chipThe clean and dust-free oven adopts a high-precision temperature control system and a dust-free filtration system, which can ensure that the chip is dried in a dry environment, prevent the chip surface from being polluted and oxidized, so as to ensure the quality and performance of the chip.2, improve production efficiency and yieldThe clean and dust-free oven uses an efficient heating method and a precise control system, which can remove water and organic matter from the surface of the chip in a short time, thereby improving production efficiency and yield. The clean and dust-free oven can also be continuously dried to reduce production time and cost.3, meet environmental requirementsThe clean and dust-free oven adopts closed design and efficient filtration system, which can avoid the discharge of waste gas and waste water, meet the environmental protection requirements, and reduce the pollution to the environment.4, to meet different drying requirementsThe clean and dust-free oven can accurately control temperature and time according to different chip types and drying requirements to meet different drying requirements and improve the quality and performance of the chip.The clean and dust-free oven plays an important role in the semiconductor industry, which can ensure the quality and performance of the chip, improve production efficiency and yield, while meeting environmental requirements and meeting different drying requirements. With the continuous development and popularization of the semiconductor industry, the application prospects of clean and dust-free ovens will be more and more broad.

I. Main technical parameters of infrared heating tunnel furnace for automotive interior panel1, inner tank size: heating zone length 5.0 meters (divided into three temperature zone control)* net height 0.1 meters * inner width 2.0 meters;2, overall size (approx.) : total length 7.6 meters * Height 1.5 meters * width 2.3 meters; The conveying surface is 0.84m ± 0.025m above the ground adjustable; Feed area 2 meters, heating section 5 meters (divided into three sections), discharge area 0.6 meters;3, temperature range: room temperature ~ +300℃;4, shell temperature: the temperature does not exceed the environment +10℃.5, circulation air mode: front and back to the middle hot air circulation;6, power supply: three-phase five-wire system, 380V, 50HZ;7, power: total power 110KW;Second, automotive interior panel infrared heating tunnel furnace structure characteristics1, shell material: 1.5㎜ cold plate bending, surface phosphating, paint treatment, corrosion resistance and easy to clean.2. Inner liner material: 1.4mm thick SUS304 stainless steel plate; Keep the inner liner clean and dust-free, rust and corrosion resistant;3, the bottom frame of the furnace body: 50*50*2.0mm square pass production; Maintaining the bearing strength of each surface inside and outside the furnace body, and retaining the coefficient of thermal expansion and cold contraction, can prevent the deformation of the furnace body.4, conveyor belt: stainless steel wire mesh conveyor belt: mesh is 10*50mm, wire diameter: 1.5mm;5, hanging ring: the top four corners of the furnace body is equipped with four rings, easy to load and unload goods;Third, automotive interior panel infrared hot wire tunnel furnace function1, overtemperature alarm: when the actual detection temperature exceeds the overtemperature protection thermostat set value, automatically cut off the heating power supply, play a double protection function;2, sound and light alarm: alarm light with buzzer.3, power supply phase, phase sequence protection: equipped with a phase sequence protector, can prevent the fan and motor reversal;

Constant temperature and humidity test room, cold and heat shock test chamber, rapid temperature change test chamber, linear temperature change test chamber can be used in large refrigeration systems, now interpret a group of 2*30HP power cascade water-cooled refrigeration system, which is a very typical cascade refrigeration system, such systems are often used in comprehensive environmental test system and environmental stress screening test refrigeration system. The simulated temperature is minus 70 ° C.High temperature refrigeration system from the compressor exhaust outlet to the suction inlet of the compressor a total of 6 loops: the first loop pump high temperature and high pressure working medium steam return compressor suction suction back air heating loop;1. Return air heating loopAfter the oil and gas separator, the high temperature and high pressure working medium steam is returned to the compressor suction port through the manual stop valve and the remote bypass valve of the solenoid valve. The working medium of this primary flow is the high temperature and high pressure working medium vapor of the compressor exhaust outlet, which is used to improve the temperature (pressure) of the refrigeration system return air to meet the requirements of the compressor intake air temperature (pressure).After the condenser, dryer filter and liquid flow mirror, there are five branches of the liquid working medium:2. Return air cooling circuitReturn to the refrigeration circuit of the compressor suction port through the solenoid valve and the internally balanced expansion valve. The function of this circuit is to reduce the temperature (pressure) of the return air of the refrigeration system. The first loop and the second loop work together to ensure that the temperature (pressure) of the suction port of the high temperature compressor is in a better working condition.3. Evaporative condenser refrigeration main circuitThrough the solenoid valve, external balanced expansion valve, distributor into the evaporative condenser refrigeration main circuit. This is the main circuit of high temperature refrigeration. The liquid working medium evaporates into gaseous working medium in the evaporating condenser and absorbs a large amount of gasification latent heat (refrigeration). The high temperature and high pressure working medium steam discharged from the low temperature stage is cooled into liquid working medium in the evaporating condenser.4. Evaporative condenser refrigeration auxiliary circuitThrough the solenoid valve, expansion valve into the evaporator condenser auxiliary refrigeration circuit. When the evaporative condenser does not need too much liquid refrigerant, close the solenoid valve, open the solenoid valve, only part of the liquid working fluid through the solenoid valve, external balance expansion valve, distributor into the evaporative condenser work, excess liquid working fluid will return to the gas pipe through other circuits;5. Dehumidification circuitThrough the solenoid valve orifice restrictor distributor flows to the dehumidification cooling loop of the dehumidification ring and the pressure regulating valve, which is used for refrigeration dehumidification loop;6. Environmental cold loopThrough the solenoid valve, expansion valve, distributor into the environmental cold ring, pressure regulating valve refrigeration circuit, this way is used for humidity and heat test temperature regulation circuit.

In many factories, when curing UV glue, UV ink, UV paint and other UV coatings in large quantities, the pipeline type UVLED curing furnace will be selected to complete the curing work. As a manufacturer of UVLED curing machine, Huafang Optoelectronics also produces a variety of UVLED curing furnaces, which can meet the diverse choices of customers from the aspects of size, heat dissipation, band, strength and so on.Huafang photoelectric line type UVLED curing furnace can be docked with the production line in the work, and achieve rapid curing effect with the production line. When the equipment that needs to be cured passes through the UV tunnel curing furnace, it is irradiated by the UV curing light source in the pipeline, so that the photoinitiator contained in the glue or ink on the equipment can react and complete the curing in a few seconds.Factory line curing application choose Huafang photoelectric UVLED curing stove has the following advantages:1. UVLED curing furnace has more advantages than traditional mercury lamp.The UV light produced by the traditional mercury lamp looks very bright, and the heat is very high, in fact, the ultraviolet band that really has the curing effect only accounts for part of the energy, and a considerable part is stray light and heat generation, which is serious to the operator's eyes and easy to make the processing workpiece thermal deformation.UVLED curing furnace emits high purity single wavelength ultraviolet light, which belongs to cold light source; When curing, the workpiece temperature only rises about 3 degrees, and the workpiece will not be deformed. The energy of UVLED curing furnace is highly concentrated in a certain ultraviolet spectrum segment with effective curing effect, and the actual use effect is similar to the curing effect of high-pressure mercury lamp with light intensity 1000-2000mw, and the curing time can be shortened.2. UVLED curing furnace greatly reduces the production cost.Because the UVLED curing furnace uses LED luminescence, the life span is more than 20,000 hours (continuous ignition life); Energy-saving design, only when the need to light up, low power consumption; And the UVLED curing furnace can be integrated into the automatic assembly process or used as a complete desktop system without affecting the original production process.The LED irradiation head used in the UVLED curing furnace is controlled by computer, which can be manually or automatically controlled according to actual needs, and set the time required for light irradiation (accurate to 0.01S) to further support the high-precision joint needs and reduce the time error of human operation.

First, the impact of UVLED energyDeep curing of ultraviolet radiation, the main condition is that the molecule must absorb the light quantum with enough energy to become an exciting molecule, decompose into free radicals or ions, so that the unsaturated organic matter polymerization, grafting, crosslinking and other chemical reactions to achieve the purpose of curing. The UVLED energy of the photoinitiator in the UV coating supplied exceeds or falls short of its required energy1, do not know the UVLED cold light source energy required by the photoinitiator, such as blind excess supply, this practice not only wastes energy, but also causes the negative effect of excessive curing, such as detonation, anti-curing reaction.2, when the UVLED energy is insufficient, the UVLED energy must be moderate, that is, it can not be excessive or insufficient, so as not to cause complete curing.Second, the influence of UV coating thicknessThe thickness of UV coating plays a key role in the effect of UV curing, the coating is too thick, the drying time is relatively long under the irradiation of the same power light source, on the one hand, the drying of UV coating will be affected, on the other hand, the surface temperature of the substrate will be too high, resulting in the deformation of the substrate; Too thin coating will lead to poor surface gloss. In addition, the color, temperature, curing speed, substrate surface and other conditions of the thickness of the UV coating need to be appropriately adjusted.Third, the effect of curing distanceAccording to the curing substrate, the UV lamp is generally about 10-15mm away. The curing distance must be properly adjusted with the substrate, coating, and irradiation power of UVLED lamps.Fourth, the effect of UV light curing speedAccording to the different substrate, coating, curing distance, adjust the curing speed of the equipment, curing speed is too fast, the UV coating on the surface of the substrate is sticky or the surface is dry and the inside is not dry; The running speed is slow, and the substrate surface will age.Five, the impact of the working environmentWhen the viscosity of UV coating changes greatly due to temperature, the room temperature should be adjusted, generally 15-25℃ is more appropriate, and pay attention to the curing can not be subjected to direct sunlight.